Business Description

Company Description by Thomasnet

Formulation of adhesives, sealants, coatings, potting, and encapsulation compounds. Specializing in the manufacturing of one and two part epoxies, silicones, UV and LED curing systems, and urethane modified and polysulfide modified epoxies. Properties include chemical resistance, thermal conductivity, high temperature resistance, biocompatibility, low outgassing, thermal and mechanical properties, and more. Products can be customized to meet specific application requirements. Serves the electronics, medical, optical, photonics, aerospace, OEM, automotive, and other high-tech industries. One-on-one assistance is provided. Product line includes compounds that comply with ASTM, USP Class VI, NASA, FAR, FDA & UL94 V-0, Mil-Std, and other certifications.

Company Description by Master Bond, Inc.

Master Bond is a leading adhesive manufacturer offering high quality adhesives, sealants, coatings, and potting compounds. Master Bond’s product line consists of epoxy adhesives, polyurethane, silicone, cyanoacrylate and latex adhesives.

Master Bond’s structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations. Adhesive properties differ in viscosity, cure speed, temperature and chemical resistance, strength, electrical and thermal conductivity.

Specific adhesive systems can be designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other hi-tech industries.

Master Bond, Inc., Hackensack, NJ

Business Details

Primary Company Type:
  • Manufacturer
Additional Activities:
  • Custom Manufacturer, Service Company, Finishing Service Company
Key Personnel:
  • Jane Trager, Marketing Dept

Diverse / Small Bus. Status

Certifications / Registrations

Annual Sales:
  • $5 - 9.9 Mil
No of Employees:
  • 10-49
Year Founded:
  • 1976

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Additional Information Provided by Master Bond, Inc.

Product Information

Room Temperature Curing Thermally Conductive Epoxy For Service Up To 400°F
Master Bond Polymer System EP21TCHT-1 is a two component epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA qualified for low outgassing applications. It is highly recommended for use in vacuum environments.
Master Bond Gun Applicator
Using a gun applicator for mixing and dispensing of two component epoxy systems.
Epoxy for Food Applications from Master Bond
Food grade epoxy system EP42HT-2FG
UV Curable Epoxy Based System UV15
Master Bond UV15 is a one component, high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It features exceptional thermal stability and very low shrinkage upon cure.
One Component Flexible High Performance Epoxy Adhesive
Master Bond Polymer System Supreme 10HTFL is a one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300°F to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above.
EP42HT-2Med biocompatible epoxy system from Master Bond
Two component, room temperature curable, high temperature resistant epoxy system, sealant, coating and casting system. EP42HT-2Med resists multiple cycles of medical sterilization including radiation, chemicals and steam. Meets USP Class VI requirements.
Physical Strength Properties of Epoxy Adhesives
Master Bond epoxies feature outstanding physical strength properties for high performance bonding, sealing, coating, potting and encapsulation. Our polymer compounds are formulated to meet challenging physical strength requirements.
The beauty of thermally conductive adhesives and potting compounds is that they can manage heat while solving other application issues. Design engineers are often faced with the task of attaining reliable performance while protecting the circuitry of complex electronic devices. Learn how advanced adhesives and related compounds can help to meet these challenges.
How to Apply Super Fast Curing Epoxy
In this demonstration, Master Bond EP65HT-1 epoxy is used to show how a fast curing compound can set up quickly at room temperature. This two part system is commonly utilized for advanced engineering applications. It is a sure winner to speed up your assembly operations.

Capabilities / Services

Around The World in 80 Seconds with Maximus Bond
Max has shaped up our epoxies, now it's time to ship them out. Join Maximus Bond as he travels the world shipping Master Bond epoxies, silicones and more. Learn about Master Bond's prompt and reliable worldwide shipping options.

News & Press Releases


Products in the News
March 16, 2023 - Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and dissimilar substrates. “Conventional light curing adhesives do not allow light penetration...
Products in the News
February 9, 2023 - Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®, Cidex® and Steris®, successfully resisting a...
Products in the News
January 6, 2023 - Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility. Supreme 42HT-2ND Black is electrically insulative with a volume resistivity greater than 1014 ohm-cm. This...
Products in the News
November 15, 2022 - Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many...
Products in the News
October 14, 2022 - Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, optoelectronic and specialty OEM industries. This system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly...
Products in the News
September 8, 2022 - Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it contains no solvents and has an “unlimited” working life at room temperature. Suitable...
Products in the News
August 2, 2022 - Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for applications that use substrates prone to stress cracking. This flexible system provides a low tensile...
Products in the News
April 12, 2022 - Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be non-cytotoxic. EP4G-80Med bonds well to a variety of substrates including metals, glass,...
Products in the News
February 1, 2022 - Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and arcs, which may lead to combustion and fire. EP21AC is designed primarily with the aim to prevent...
Products in the News
January 6, 2022 - Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as...
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White Papers & Case Studies

Epoxies Safeguard Medical Electronic Devices
Specialty formulations of epoxies protect medical electronic devices from stress, vibration, shielding and grounding. View More and Download
Stating that the current microprocessors dissipate up to 100 W, this paper briefs about the challenge faced by design engineers, and explains how thermal interface materials, which fill in the air gaps between thermal transfer surfaces, are one of... View More and Download
This paper provides an understanding of the chemistry, properties, and applications of low-outgassing ASTM E595-compliant adhesives. The industry standard test for measuring outgassing in adhesives and other materials, ASTM E595, is explained,... View More and Download
Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
A guide to properly protecting Chip on Board (COB) using glob top encapsulants. View More and Download
Sterilization of Medical Equipment
Check out this white paper to learn about sterilization options for adhesives, sealants, and coatings that will be used in medical equipment. View More and Download
Spotlight on Silicones
Check out this white paper to learn about the properties, characteristics, and applications of silicones. View More and Download
View All White Papers & Case Studies